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dc.contributor.author
Seok, Seonho
dc.contributor.author
Cristiano, Giorgio
dc.contributor.author
Jang, Taekwang
dc.date.accessioned
2020-08-19T13:59:20Z
dc.date.available
2020-07-23T18:47:58Z
dc.date.available
2020-08-19T13:59:20Z
dc.date.issued
2020
dc.identifier.isbn
978-1-7281-8901-7
en_US
dc.identifier.other
10.1109/dtip51112.2020.9139160
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/428290
dc.description.abstract
This paper presents an energy efficient pulse-driven on-chip MEMS oscillator which consists of MEMS resonator and sustaining CMOS circuit. Conventional oscillators are driven by means of an inverter-based amplifier low-pass filtered through a series resistor. However, this architecture suffers from multiple energy losses. Firstly, the inverter amplifier is driven by a sinusoidal input, thus consuming significant static power. Additional power is also consumed by the series resistance. The proposed pulsed driver provides a 180° degree shift, effectively replacing the amplifier. The driver injects energy in the oscillator by periodically switching one oscillator end to V DD when the other end reaches the bottom voltage, and to V SS when the other end reaches the peak voltage. The proposed configuration reduces the static power consumption, as the switch is driven by two rectangular voltages and reduces leakage by activating only one of the two switches at a time. This pulse-driven oscillator, running at 33.14kHz, is simulated to consume 835pW when driven at 0.8V, leading to more than ×15 power saving with respect to the traditional configuration, which consumes 13.2nW.
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.subject
Low power
en_US
dc.subject
pulse-driven
en_US
dc.subject
MEMS oscillator
en_US
dc.title
Design of Ultra-Low Power Pulse-Driven MEMS Oscillator
en_US
dc.type
Conference Paper
dc.date.published
2020-07-13
ethz.book.title
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
en_US
ethz.pages.start
9139160
en_US
ethz.size
5 p.
en_US
ethz.event
22nd Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2020) (virtual)
en_US
ethz.event.location
Lyon, France
en_US
ethz.event.date
June 15-25, 2020
en_US
ethz.notes
Due to the Corona virus (COVID-19) the conference was conducted virtually.
en_US
ethz.identifier.scopus
ethz.publication.place
Piscataway, NJ
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02636 - Institut für Integrierte Systeme / Integrated Systems Laboratory::09647 - Jang, Taekwang / Jang, Taekwang
en_US
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02636 - Institut für Integrierte Systeme / Integrated Systems Laboratory::09647 - Jang, Taekwang / Jang, Taekwang
en_US
ethz.date.deposited
2020-07-23T18:48:21Z
ethz.source
FORM
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2020-08-19T13:59:31Z
ethz.rosetta.lastUpdated
2021-02-15T16:34:50Z
ethz.rosetta.versionExported
true
ethz.COinS
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