3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
dc.contributor.author
Vandooren, Anne
dc.contributor.author
Franco, Jacopo
dc.contributor.author
Wu, Zhuoheng
dc.contributor.author
Parvais, Bertrand
dc.contributor.author
Witters, Liesbeth Johanna
dc.contributor.author
Walke, Amey Mahadev
dc.contributor.author
Li, Wei
dc.contributor.author
Peng, Lan
dc.contributor.author
Desphande, Veeresh
dc.contributor.author
Bufler, Fabian M.
dc.contributor.author
Rassoul, Nouredine
dc.contributor.author
Hellings, Geert
dc.contributor.author
Jamieson, Geraldine
dc.contributor.author
Inoue, Fumihiro
dc.contributor.author
Verbinnen, Greet
dc.contributor.author
Devriendt, Katia
dc.contributor.author
Teugels, Lieve G.
dc.contributor.author
Heylen, Nancy
dc.contributor.author
Vecchio, Emma
dc.contributor.author
Zheng, Tao
dc.contributor.author
Rosseel, Erik
dc.contributor.author
Vanherle, Wendy
dc.contributor.author
Chan, Boon Teik
dc.contributor.author
Hikavyy, Andriy Y.
dc.contributor.author
Rítzenthaler, Romain
dc.contributor.author
Besnard, Guillaume
dc.contributor.author
Schwarzenbach, Walter
dc.contributor.author
Gaudin, Gweltaz
dc.contributor.author
Radu, Ionut
dc.contributor.author
Nguyen, Bich Yen
dc.contributor.author
Waldron, Niamh S.
dc.contributor.author
De Heyn, Vincent
dc.contributor.author
Mocuta, Dan M.
dc.contributor.author
Collaert, Nadine
dc.date.accessioned
2019-05-10T06:01:12Z
dc.date.available
2019-05-10T06:01:12Z
dc.date.issued
2018-06
dc.identifier.isbn
978-1-5386-4218-4
en_US
dc.identifier.isbn
978-1-5386-4219-1
en_US
dc.identifier.other
10.1109/VLSIT.2018.8510705
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/341535
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.title
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
en_US
dc.type
Conference Paper
dc.date.published
2018-10-29
ethz.book.title
2018 IEEE Symposium on VLSI Technology
en_US
ethz.pages.start
69
en_US
ethz.pages.end
70
en_US
ethz.event
38th IEEE Symposium on VLSI Technology
en_US
ethz.event.location
Honolulu, HI, USA
en_US
ethz.event.date
June 18-22, 2018
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.publication.place
Piscataway, NJ
en_US
ethz.publication.status
published
en_US
ethz.date.deposited
2018-11-30T05:32:23Z
ethz.source
SCOPUS
ethz.source
WOS
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2019-05-10T06:01:19Z
ethz.rosetta.lastUpdated
2019-05-10T06:01:19Z
ethz.rosetta.exportRequired
false
ethz.rosetta.versionExported
true
dc.identifier.olduri
http://hdl.handle.net/20.500.11850/307490
dc.identifier.olduri
http://hdl.handle.net/20.500.11850/340412
ethz.COinS
ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.atitle=3D%20sequential%20stacked%20planar%20devices%20on%20300%20mm%20wafers%20featuring%20replacement%20metal%20gate%20junction-less%20top%20devices%20processed%20at%20525%C2%&rft.date=2018-06&rft.spage=69&rft.epage=70&rft.au=Vandooren,%20Anne&Franco,%20Jacopo&Wu,%20Zhuoheng&Parvais,%20Bertrand&Witters,%20Liesbeth%20Johanna&rft.isbn=978-1-5386-4218-4&978-1-5386-4219-1&rft.genre=proceeding&rft_id=info:doi/10.1109/VLSIT.2018.8510705&rft.btitle=2018%20IEEE%20Symposium%20on%20VLSI%20Technology
Dateien zu diesem Eintrag
| Dateien | Größe | Format | Im Viewer öffnen |
|---|---|---|---|
|
Zu diesem Eintrag gibt es keine Dateien. |
|||
Publikationstyp
-
Conference Paper [35672]