3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
Metadata only
Datum
2018-06Typ
- Conference Paper
Publikationsstatus
publishedExterne Links
Buchtitel
2018 IEEE Symposium on VLSI TechnologySeiten / Artikelnummer
Verlag
IEEEKonferenz