Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

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Author
Brunschwiler, Thomas
Schlottig, Gerd
Sridhar, Arvind
Bezerra, Pedro A.M.
Ruch, Patrick
Ebejer, Neil
Oppermann, Hermann
Kleff, Jessika
Steller, Wolfram
Jatlaoui, Mohamed
Voiron, Frederic
Pavlovic, Zoran
McCloskey, Paul
Bremner, Douglas
Parida, P.
Krismer, Florian
Kolar, Johann W.cc
Michel, Bruno
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Date
2017
Type
    Conference Paper
Publication status
published
External links
Book title
2017 IEEE International Electron Devices Meeting (IEDM)
Pages / Article No.
3.7.1 - 3.7.4
Publisher
IEEE
Event
63rd IEEE Annual International Electron Devices Meeting (IEDM 2017), San Francisco, CA, USA, December 2-6, 2017
Organisational unit
03573 - Kolar, Johann W. (emeritus) / Kolar, Johann W. (emeritus)  
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Citations
Cited 3 times in Scopus
ETH Bibliography
yes
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