Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration - Research Collection

Metadata only

Datum

2017

Typ

Conference Paper

Zitate

3 Zitate in Scopus

ETH Bibliographie

yes

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Publikationsstatus

published

Externe Links

https://doi.org/10.1109/IEDM.2017.8268322

Buchtitel

2017 IEEE International Electron Devices Meeting (IEDM)

Seiten / Artikelnummer

3.7.1 - 3.7.4

Verlag

IEEE

Konferenz

63rd IEEE Annual International Electron Devices Meeting (IEDM 2017), San Francisco, CA, USA, December 2-6, 2017

Organisationseinheit

03573 - Kolar, Johann W. (emeritus) / Kolar, Johann W. (emeritus)

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Zitate

3 Zitate in Scopus

ETH Bibliographie

yes

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